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Koch Chemie Foam Pad Bundle - 4 Pack

Koch Chemie Foam Pad Bundle - 4 Pack

Rated 5.0 out of 5
Based on 1 review

Regular price $84.90 AUD

Unit price per 

Size

This Bundle contains the 6 inch pads of:

  • Koch Chemie Fine Cut Pad
  • Koch Chemie Heavy Cut Pad
  • Koch Chemie Micro Cut Pad
  • Koch Chemie Polishing & Sealing Pad

The Koch Chemie Fine Cut Pad is a medium abrasive sponge for removing moderate weathering and scratches.

The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contributes to a high level of abrasiveness and excellent hygiene factors.

Features & Benefits:

  • Suitable for polishing
  • Removes moderate weathering and scratches
  • Use with a Dual Action (DA) polisher
  • Suitable for all types of paintwork including scratch resistant finishes
  • Durable pad resistant to wear & tear
  • Machine washable

Technical Specification:

  • Depth: 23mm
  • Construction: Reticulated (open cell)
  • Abrasiveness: 5
  • Compression Hardness: 12

 

The Koch Chemie Heavy Cut Pad is made from abrasive sponge and designed to remove strong weathering and deep scratches working in collaboration with Koch Chemie H9 Heavy Cut Compound. The short height of 23mm creates low torsion forces whilst providing a high level of stability and excellent handling. The unique density of the foam enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad. The milling edge enables increased flexibility, allowing them to move around contours more easily.

Features & Benefits:

  • Long lasting compression
  • Removes strong weathering and scratches
  • Use with a Dual Action (DA) polisher
  • Suitable for all types of paintwork including scratch resistant finishes
  • Durable pad resistant to wear & tear
  • Machine washable

Technical Specification:

  • Depth: 23mm
  • Construction: Reticulated (open cell)
  • Abrasiveness: 9
  • Compression Hardness: 17

 

The Koch Chemie Micro Cut Pad is a high-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01.

The short height of 23mm creates low torsion forces, very good handling and the highest level of stability.

The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors.

The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier.

The colorful non-woven material, suitable for polishing, ensures process safety.

Technical Specification:

  • Depth: 23mm
  • Construction: Reticulated (open cell)
  • Abrasiveness: 5
  • Compression Hardness:10

 

The Koch Chemie Polishing & Sealing Pad is made from extra fine sponge designed to economically and evenly apply sealing products such as Koch Chemie 1K Nano.

The short height of 23mm creates low torsion forces whilst providing a high level of stability and excellent handling. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad.

The milling edge enables increased flexibility, allowing them to move around contours more easily.

Technical Specification:

  • Depth: 23mm
  • Abrasiveness: 2
  • Compression Hardness: 4

Made in Germany

average rating 5.0 out of 5
Based on 1 review
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100% of reviewers would recommend this product to a friend
1 Review
Reviewed by Jon B., from Australia
Verified Buyer
I recommend this product
Rated 5 out of 5
Review posted

Great pads to suit great compounds

Durable pads, work great with recommended compounds. Not the cheapest but you pay for quality. Definitely recommend

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