The Koch Chemie Micro Cut Pad is a high-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01.
The short height of 23mm creates low torsion forces, very good handling and the highest level of stability.
The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors.
The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier.
The colorful non-woven material, suitable for polishing, ensures process safety.